UltraScan II 20 mm

The product is mainly used for the processing of non-metallic and partial metallic materials, and it has been widely used in the laser processing fields such as food packaging, beverage packaging, medicine packaging, building ceramics, buttons, craft gifts, electronic components, mobile phone shells, laptop and tablet shells, wire stripping, film cutting, PCB barcodes, shell nameplate, etc.

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Features

Low noise, high linearity and low drift

Applicable to a variety of F-theta lenses

Modular design, easy integration and maintenance

Standard protocol: 16bit XY2-100, 20bit ST2-100

Parameters

UltraScan Ⅱ	20 mm
Input Beam Aperture (mm)	20
Beam Displacement (mm)	25.25
Tracking Error (ms)	0.35
Repeatability (µrad)	＜2
Oﬀset Drift (µrad/K)	＜12
Gain Drift (ppm/K)	＜50
Long-Term Drift over 8h (mrad)	＜0.1
1% of Full Travel (ms)	0.7
10% of Full Travel (ms)	2.4
Positioning Speed (m/s)①	6
Scan Angle (°)②	± 25
Gain Error (mrad)	＜5
Offset Error (mrad)	＜5
Nonlinearity (%)	＜0.4 ＜0.2(UltraScan III)
Power Requirements	±15VDC, ≥3A
Communication Protocol	16bit: XY2-100
Operation Temperature (℃)	25±10
Weight (kg)	5

*All specifications are typical data and subject to change without notice due to product improvements.
① Test using F-theta lens with focal length F=160mm
② All angles above are optical angles

Contact

Have a specific application challenge? Need a system quote or feasibility study? Our laser application experts are ready to collaborate.

We are here for you.

+49 (0) 7141 8535 0

information@hl-components.com

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